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DISCRETE SEMICONDUCTORS
DATA SHEET
M3D369
BGY206 UHF amplifier module
Product specification Supersedes data of 1998 Apr 15 1998 May 08
Philips Semiconductors
Product specification
UHF amplifier module
FEATURES * 4.8 V nominal supply voltage * 3 W output power * Easy control of output power by DC voltage. APPLICATIONS * Digital cellular radio systems with Time Division Multiple Access (TDMA) operation (GSM systems) in the 880 to 915 MHz frequency range. DESCRIPTION The BGY206 is a three-stage UHF amplifier module in a SOT388B package. The module consists of three NPN silicon planar transistor dies mounted together with matching and bias circuit components on a metallized ceramic substrate. PINNING - SOT388B PIN 1 2 3 4 Flange RF input VC VS RF output ground
BGY206
DESCRIPTION
handbook, halfpage
1 Top view
2
3
4
MBK197
Fig.1 Simplified outline.
QUICK REFERENCE DATA RF performance at Tmb = 25 C. MODE OF OPERATION Pulsed; = 1 : 8 f (MHz) 880 to 915 VS (V) 4.8 VC (V) 3.5 PL (W) 3 Gp (dB) 30 (%) typ. 45 ZS; ZL () 50
1998 May 08
2
Philips Semiconductors
Product specification
UHF amplifier module
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VS VC PD PL Tstg Tmb PARAMETER DC supply voltage DC control voltage input drive power load power storage temperature operating mounting base temperature CONDITIONS VC < 0.5 V - - - - -40 -30 MIN. 10 4 13 3.5 +100 +100 MAX.
BGY206
UNIT V V mW W C C
CHARACTERISTICS ZS = ZL = 50 ; PD = 3 mW; VS = 4.8 V; VC 3.5 V; f = 880 to 915 MHz; Tmb = 25 C; = 1 : 8; tp = 575 s; unless otherwise specified. SYMBOL IQ IC PL Gp H2 H3 VSWRin PARAMETER leakage current control current load power power gain efficiency second harmonic third harmonic input VSWR stability VC = 0.5 V adjust VC for PL = 3 W VC = 3.5 V VC = 3.5 V; VS = 4.3 V; Tmb = 85 C adjust VC for PL = 3 W adjust VC for PL = 3 W adjust VC for PL = 3 W adjust VC for PL = 3 W adjust VC for PL = 3 W PD = 1.5 to 6 mW; VS = 4 to 6.5 V; VC = 0 to 3.5 V; PL 3 W; VSWR 6 : 1 through all phases VC = 0.5 V PL = 3 W; bandwidth = 30 kHz; 20 MHz above transmission band VS = 6.5 V; adjust VC for PL = 3 W; VSWR 10 : 1 through all phases CONDITIONS - - 3 2 30 40 - - - - MIN. - - - - - 45 - - - - TYP. MAX. 100 500 - - - - -40 -40 2.5 : 1 -60 dBc UNIT A A W W dB % dBc dBc
isolation control bandwidth Pn noise power ruggedness
- 1 -
- - -
-36 - -85
dBm MHz dBm
no degradation
1998 May 08
3
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
MGD352
handbook, halfpage
50
40 PL (dBm) 30
MGD353
PL (dBm) 30 880 MHz 915 MHz 10
20
915 MHz 10
-10 0
880 MHz
-30 1.2
1.6
2.0
2.4
2.8
3.2 3.6 VC (V)
-10 -25
-20
-15
-10
-5
0 5 PD (dBm)
ZS = ZL = 50 ; VS = 4.8 V; PD = 3 mW; Tmb = 25 C; = 1 : 8; tp = 575 s.
ZS = ZL = 50 ; VS = 4.8 V; adjust VC for PL = 3 W; Tmb = 25 C; = 1 : 8; tp = 575 s.
Fig.2
Load power as a function of control voltage; typical values.
Fig.3
Load power as a function of drive power; typical values.
handbook, halfpage
6
MBK512
MGD355
handbook, halfpage
50
PL (W) 4 880 MHz 915 MHz
(%)
915 MHz
40
880 MHz 30
20 2 10
0 4 5 6 VS (V) 7
0 0 1 2 3 P L (W) 4
ZS = ZL = 50 ; VC = 3.5 V; PD = 3 mW; Tmb = 25 C; = 1 : 8; tp = 575 s.
ZS = ZL = 50 ; VS = 4.8 V; PD = 3 mW; Tmb = 25 C; = 1 : 8; tp = 575 s
Fig.4
Load power as a function of supply voltage; typical values.
Fig.5
Efficiency as a function of load power; typical values.
1998 May 08
4
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
MGD356
MGD357
handbook, halfpage
5
handbook, halfpage
4
PL (W) 4
VC (V) 3
3 2 2
1 1
0 880
890
900
910
f (MHz)
920
0 880
890
900
910
f (MHz)
920
ZS = ZL = 50 ; VS = 4.8 V; PD = 3 mW; VC = 3.5 V; Tmb = 25 C; = 1 : 8; tp = 575 s.
ZS = ZL = 50 ; VS = 4.8 V; PD = 3 mW; PL = 3 W; Tmb = 25 C; = 1 : 8; tp = 575 s.
Fig.6
Load power as a function of frequency; typical values.
Fig.7
Control voltage as a function of frequency; typical values.
-30 H2, H3 (dBc) -40
MGD358
MGD359
handbook, halfpage
4
VC (V) 3 915 MHz 2 H3 880 MHz
-50
H2
1
-60 880
890
900
910
f (MHz)
920
0 -40
0
40
Tmb (oC)
80
ZS = ZL = 50 ; VS = 4.8 V; PD = 3 mW; PL = 3 W; Tmb = 25 C; = 1 : 8; tp = 575 s.
ZS = ZL = 50 ; VS = 4.8 V; PD = 3 mW; PL = 3 W; = 1 : 8; tp = 575 s.
Fig.8
Harmonics as a function of frequency; typical values.
Fig.9
Control voltage as a function of mounting base temperature; typical values.
1998 May 08
5
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
MGD360
MGD361
handbook, halfpage
5
handbook, halfpage
5
PL (W) 4 880 MHz 3 915 MHz 2
PL (W) 4 880 MHz 915 MHz 3
2
1
1
0 -20
0
20
40
60 80 Tmb (oC)
0 -20
0
20
40
60 80 Tmb (oC)
ZS = ZL = 50 ; VS = 4.3 V; PD = 3 mW; VC = 3.5 V; = 1 : 8; tp = 575 s.
ZS = ZL = 50 ; VS = 4.8 V; PD = 3 mW; VC = 3.5 V; = 1 : 8; tp = 575 s.
Fig.10 Load power as a function of mounting base temperature (reduced supply voltage); typical values.
Fig.11 Load power as a function of mounting base temperature; typical values.
MGD362
handbook, halfpage
30
handbook, halfpage
10
MGD354
Gp (dB)
PL = 25 dBm 15 dBm
Output AM (%) 8
20 6 34.8 dBm 4 10 2 880 MHz 915 MHz
0 0 1 2 f (MHz) 3
0 0 10 20 30 PL (dBm) 40
ZS = ZL = 50 ; VS = 4.8 V; PD = 3 mW; f = 900 MHz; C1 = 0; R1 = 100 ; Tmb = 25 C; = 1 : 8; tp = 575 s.
ZS = ZL = 50 ; VS = 4.8 V; PD = 3 mW; Tmb = 25 C; input amplitude modulation = 3%; = 1 : 8; tp = 575 s.
Fig.12 Control loop power gain as a function of frequency on the control pin; typical values.
Fig.13 Output amplitude modulation as a function of load power; typical values.
1998 May 08
6
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
handbook, full pagewidth
C5 C2
C1 Z1 R1
L1 C3 Z2
C4 typ. 1.35A
RF input
VC
MBK513
VS
RF output
Fig.14 Test circuit.
handbook, full pagewidth
1
90 2 34
50 input
50 output 47
VC
VS
MBH435
Dimensions in mm.
Fig.15 Printed-circuit board layout.
1998 May 08
7
Philips Semiconductors
Product specification
UHF amplifier module
List of components (See Fig 14) COMPONENT C1, C2 C3 C4 C5 L1 Z1, Z2 R1 Note DESCRIPTION multilayer ceramic chip capacitor tantalum capacitor electrolytic capacitor multilayer ceramic chip capacitor Grade 4S2 Ferroxcube bead stripline; note 1 metal film resistor 50 100 ; 0.6 W width 2.33 mm VALUE 680 pF 2.2 F; 35 V 47 F; 40 V 100 nF DIMENSIONS -
BGY206
CATALOGUE NO. 2222 851 11681 2222 030 37479 2222 852 47104 4330 030 36300 - 2322 156 11001
1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (r = 2.2); thickness 132 inch.
1998 May 08
8
Philips Semiconductors
Product specification
UHF amplifier module
SOLDERING The indicated temperatures are those at the solder interfaces. Advised solder types are types with a liquidus less than or equal to 210 C. Solder dots or solder prints must be large enough to wet the contact areas. Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens. A double reflow process is permitted. Hand soldering must be avoided because the soldering iron tip can exceed the maximum permitted temperature of 250 C and damage the module. The maximum allowed temperature is 250 C for 5 seconds. The maximum ramp-up is 10 C per second. The maximum cool-down is 5 C per second. Cleaning The following fluids may be used for cleaning: * Alcohol * Bio-Act (Terpene Hydrocarbon) * Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product.
0 0 1 2 3 4 300
BGY206
MGM159
handbook, halfpage
T (C) 200
100
t (min)
5
Fig.16 Recommended reflow temperature profile.
1998 May 08
9
Philips Semiconductors
Product specification
UHF amplifier module
BGY206
handbook, full pagewidth
17.7 12.5 12 6
4 8.75 footprint metallization solder area occupied area 2.9 1.8 1 0.57 0.7 1.37 5.08 5.08 17.9 1.7 2.54 6.75
12.5
17.1 12.4 12.1 6.4
solder area 5.55 2.45
7.55
1.67 2.7 1.1 0.5 1.37 5.08 5.08 1.5 2.54
MGM150
Dimensions in mm.
Fig.17 Footprint SOT388B.
1998 May 08
10
Philips Semiconductors
Product specification
UHF amplifier module
PACKAGE OUTLINE Rectangular single-ended surface-mount package; metal cap; 4 in-line leads
BGY206
SOT388B
U
A
y
E
U1
1 L
2
3
4
Q
b Z e e e1
wM
c
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 2.2 1.8 b 0.56 0.46 c 0.30 0.20 e 5.08 e1 2.54 E 12.2 11.8 L 0.7 0.3 Q 3.4 3.0 U 17.3 16.9 U1 6.0 5.6 w 0.25 y 0.15 Z 2.3 1.9
OUTLINE VERSION SOT388B
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 97-11-19
1998 May 08
11
Philips Semiconductors
Product specification
UHF amplifier module
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
BGY206
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 May 08
12
Philips Semiconductors
Product specification
UHF amplifier module
NOTES
BGY206
1998 May 08
13
Philips Semiconductors
Product specification
UHF amplifier module
NOTES
BGY206
1998 May 08
14
Philips Semiconductors
Product specification
UHF amplifier module
NOTES
BGY206
1998 May 08
15
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
125108/00/04/pp16
Date of release: 1998 May 08
Document order number:
9397 750 03827

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